Almit - High quality Solder Wire and Solder Paste

Soldering Flux – Reliable Solutions for Repair and Cable Soldering

Almit offer a wide range of soldering flux designed for both repair soldering and cable soldering applications. Almit's flux is available in various viscosities to suit various needs:

• RC-15SH – a low-viscosity liquid flux, available in 1L bottles or as a convenient flux pen

• BM1 Flux Gel – a high-viscosity flux for precise application

• BM 5000 – a medium-viscosity flux, providing the perfect balance between liquid and gel types

• RC-281PF is a “No-clean” lead-free (Pb-free) flux agent from Almit

Flux works by breaking down oxides on metal surfaces, ensuring that solder flows smoothly and evenly for strong, reliable solder joints.

Almit Solder Wire – Lead-Free & Leaded Alloys for Precision & Reliability

Choose from a wide portfolio of Almit solder wires, including both lead-free alloys (such as LFM-48 / SAC305, LFM-22, SJM-03-S) and traditional leaded wires (Sn60Pb40, Sn62Pb36Ag, etc.). Each variant is available with flux cores (no-clean, RMA) and multiple diameters (from ultra fine 0.2 mm up to ~2.7 mm) to suit everything from fine-pitch SMT work to robust through-hole or hand-soldering tasks.

Key Benefits:

• Excellent wetting on difficult surfaces; reduced soldering tip wear
• Halogen-free and lead-free options to comply with modern environmental and regulatory requirements
• High joint strength and reliability with low silver alternatives to balance cost and performance
• Special alloys optimized for laser/robotic soldering, fine components, and precision electronics

Application Areas:

• SMT / micro-pitch component assembly
• Repair / rework of PCBs
• Industrial, automotive, aerospace electronics
• Legacy systems requiring Sn-Pb alloys

Almit Solder Paste — Advanced SMT & Stencil Printing Solutions

Almit offers a full line of high-performance solder pastes for electronics manufacturing, including both lead-free and leaded variants. Designed for SMT printing, dispensing, and high-density PCB assembly, these pastes deliver excellent printability, reliable wetting, and long shelf life.

Why Choose Almit Solder Paste

• Consistent particle size for uniform prints, reduced bridging and defects
• Variants for small area ratio (<0.6) applications
• Low-void additives and long open times
• Strong wetting across common substrate materials (e.g. copper, nickel)
• Suitable for high-volume and precision applications

Typical Applications

• SMT stencil printing for PCBs with dense component layouts
• Dispensing pastes for selective soldering or repair work
• High reliability / telecom / industrial electronics
• Where regulatory compliance is needed (RoHS, IPC standards, etc.)

Almit Solder Bars – Lead-Free & High-Performance Solid Alloys for Flow and Dip Soldering

Almit solder bars are engineered for maximum reliability in wave soldering, flow soldering, and dip soldering applications. With advanced alloy formulations like SAC305 and Sn-Cu based systems, Almit solder bars deliver consistent wetting, reduced oxidation, and excellent resistance to copper leaching. Available in multiple alloy variants, they ensure superior results for both industrial production and precision electronics manufacturing.

Key Features of Almit Solder Bars

• Lead-Free & RoHS Compliant – environmentally safe solder alloys

• Optimized for Flow & Dip Soldering – stable performance under high heat

• Antioxidant Additives – reduces oxidation, improves solder joint quality

• Copper-Leaching Resistance – longer bath life, better PCB protection

• Multiple Alloy Options – including SAC305, LFM-41H, LFM-59H, LFM-62H